Language

USB3.0 motherboard series

Products

Contact Us

USB AM3.0 90 degree sinking board, male head, straight foot, no pillar DIP LCP, blue adhesive

This product adopts a 90 degree sinking board design, suitable for vertical installation of PCB board edges. The sinking board height can be customized (conventional 0.8-2.0mm), and the DIP straight leg column free structure simplifies the soldering process, supporting wave soldering and reflow soldering. The USB 3.0 protocol supports 5Gbps high-speed data transmission and is compatible with USB 2.0 (480Mbps), making it suitable for consumer electronics and industrial devices that require a 90 degree corner connection. The shell and pins are injection molded with LCP (liquid crystal polymer) material, and sealed with blue glue (epoxy resin) to enhance waterproof and dustproof performance (IPX4). They can withstand temperatures up to 125 ℃ and comply with RoHS environmental standards.

  • Description
  • Product Compliance
  • Precautions
  • Make an inquiry

    Industry certification:

    USB-IF certification (USB3.0 Gen2), compliant with USB 3.2 Specification Rev 1.0; RoHS 2011/65/EU (lead-free, halogen-free), REACH SVHC has passed 233 tests.

    CE/FCC electromagnetic compatibility certification, conducted interference<40dB μ V (30MHz-1GHz), radiated interference<30dB μ V (30MHz-10GHz).

    Production control:

    Sampling is conducted for each batch, including contact impedance testing (initial<50m Ω,<70m Ω after 5000 insertions and removals), voltage withstand testing (1000V AC/1min no breakdown), and blue adhesive curing degree testing (≥ 95%).






    For more information, please contact us:


    - Hotline: +86 13310802726


    - Email: mc13310802726@163.com


    Installation requirements:

    The wave soldering temperature is controlled at 260 ± 5 ℃, and the soldering time is 5-8 seconds; Reflow soldering peak ≤ 255 ℃, to avoid overheating and yellowing of the blue glue (with a maximum temperature resistance of 120 ℃).

    The height tolerance of the sinking plate is ± 0.1mm. It is recommended to use a positioning fixture, and the distance between the PCB opening and the male head should be ≤ 0.1mm to prevent welding deviation.

    Usage restrictions:

    Non waterproof models (unopened blue glue) are prohibited from coming into contact with liquids. Sealed models should be checked for cracks in the blue glue after long-term use (recommended replacement cycle of 1 year).

    When the current exceeds 0.9A, a 100 μ F electrolytic capacitor needs to be connected in parallel. The thickness of the PCB copper foil should be ≥ 35 μ m (1oz) to avoid overheating of the VBUS pin.

    Compatibility Description:

    When connecting to a USB 2.0 device, the speed automatically drops to 480Mbps. It is recommended to use a USB 3.0 certified cable (such as AWG28 specification), as non certified cables may cause unstable transmission.

    Maintenance suggestion:

    Wipe the interface with anhydrous ethanol during cleaning to avoid using chlorine containing solvents; In industrial environments, compressed air (0.5MPa) is used quarterly to remove dust from the gaps of the blue glue to prevent short circuits caused by foreign objects.






    For more information, please contact us:


    - Hotline: +86 13310802726


    - Email: mc13310802726@163.com


    If you have any special requirements or questions that require prior consultation. Please fill out the following form and we will have the specialist contact you as soon as possible.