This product adopts a 90 degree sinking board design, suitable for vertical installation of PCB board edges. The sinking board height can be customized (conventional 0.8-2.0mm), and the DIP straight leg column free structure simplifies the soldering process, supporting wave soldering and reflow soldering. The USB 3.0 protocol supports 5Gbps high-speed data transmission and is compatible with USB 2.0 (480Mbps), making it suitable for consumer electronics and industrial devices that require a 90 degree corner connection. The shell and pins are injection molded with LCP (liquid crystal polymer) material, and sealed with blue glue (epoxy resin) to enhance waterproof and dustproof performance (IPX4). They can withstand temperatures up to 125 ℃ and comply with RoHS environmental standards.