Installation requirements:
The reflow soldering temperature should be controlled within 255 ℃, and the holding time above 217 ℃ should be ≤ 90 seconds to avoid discoloration of the LCP shell (with a maximum temperature resistance of 280 ℃ and short-term tolerance).
The tolerance between the 1.0mm positioning column and the PCB through-hole is ≤ 0.05mm. It is recommended to design positioning slots to assist installation. After welding, use a 2x magnifying glass to check the fullness of the solder joints.
Usage restrictions:
Non waterproof design prohibits exposure to humid environments, and the iron shell needs to be grounded to enhance EMI shielding. When not grounded, the shielding effectiveness decreases by 50%.
When the current exceeds 0.9A, a 100 μ F electrolytic capacitor needs to be connected in parallel. The thickness of the PCB copper foil should be ≥ 35 μ m (1oz) to avoid overheating of the VBUS pin.
Compatibility Description:
When connected to a USB 3.0 device, the data transfer rate automatically drops to 480Mbps. It is recommended to use a USB 2.0 certified cable (such as AWG28 specification), as non certified cables may cause unstable transmission.
Maintenance suggestion:
Wipe the interface with anhydrous ethanol during cleaning to avoid using chlorine containing solvents; In industrial environments, compressed air (0.5MPa) is used quarterly to remove dust from iron shell gaps and prevent short circuits caused by foreign objects.
For more information, please contact us:
- Hotline: +86 13310802726
- Email: mc13310802726@163.com