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USB2.0 motherboard series

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AF2.0 board with rear two feet SMT 1.0 pillar iron shell straight edge LCP beige

This product is a USB 2.0 A-type female socket, which adopts a board mounted SMT design with two rear legs and is compatible with PCB surface mount technology. The 1.0mm diameter positioning column ensures installation accuracy, and the iron shell straight edge structure enhances mechanical strength and EMI shielding ability. The shell is made of LCP beige material injection molded, with a temperature resistance of up to 280 ℃, combining high strength and insulation, suitable for consumer electronics, industrial control and other scenarios, complying with RoHS environmental standards, supporting 480Mbps data transmission and 5V/0.9A power supply.

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    Industry certification:

    USB-IF certification (USB 2.0 Full Speed), compliant with USB 2.0 Specification Rev 1.1; RoHS 2011/65/EU (lead-free, halogen-free), REACH SVHC has passed 233 tests.

    CE/FCC electromagnetic compatibility certification, conducted interference<40dB μ V (30MHz-1GHz), radiated interference<30dB μ V (30MHz-10GHz).

    Production control:

    Sampling is conducted for each batch, including contact impedance testing (initial<50m Ω,<70m Ω after 5000 insertions and removals), withstand voltage testing (500V AC/1min no breakdown), and LCP shell color difference testing (Δ E<1.5).






    For more information, please contact us:


    - Hotline: +86 13310802726


    - Email: mc13310802726@163.com


    Installation requirements:

    The reflow soldering temperature should be controlled within 255 ℃, and the holding time above 217 ℃ should be ≤ 90 seconds to avoid discoloration of the LCP shell (with a maximum temperature resistance of 280 ℃ and short-term tolerance).

    The tolerance between the 1.0mm positioning column and the PCB through-hole is ≤ 0.05mm. It is recommended to design positioning slots to assist installation. After welding, use a 2x magnifying glass to check the fullness of the solder joints.

    Usage restrictions:

    Non waterproof design prohibits exposure to humid environments, and the iron shell needs to be grounded to enhance EMI shielding. When not grounded, the shielding effectiveness decreases by 50%.

    When the current exceeds 0.9A, a 100 μ F electrolytic capacitor needs to be connected in parallel. The thickness of the PCB copper foil should be ≥ 35 μ m (1oz) to avoid overheating of the VBUS pin.

    Compatibility Description:

    When connected to a USB 3.0 device, the data transfer rate automatically drops to 480Mbps. It is recommended to use a USB 2.0 certified cable (such as AWG28 specification), as non certified cables may cause unstable transmission.

    Maintenance suggestion:

    Wipe the interface with anhydrous ethanol during cleaning to avoid using chlorine containing solvents; In industrial environments, compressed air (0.5MPa) is used quarterly to remove dust from iron shell gaps and prevent short circuits caused by foreign objects.






    For more information, please contact us:


    - Hotline: +86 13310802726


    - Email: mc13310802726@163.com


    If you have any special requirements or questions that require prior consultation. Please fill out the following form and we will have the specialist contact you as soon as possible.