Language

Type-c heightening mother block series

Products

Contact Us

TYPE C female base 16PIN board is padded 1.6 CH=3.18 the third mock examination elastic 301 high conductivity copper LCP

This product adopts a board mounted height design of 1.6mm, with an overall height of CH=3.18mm, suitable for the PCB layout requirements of ultra-thin devices. The 16PIN structure supports USB3.1 Gen2 (10Gbps) and DisplayPort 1.4( 4K@60Hz )USB PD 3.0 (100W) the third mock examination protocol can synchronously realize high-speed data transmission, high-definition video output and high-power fast charging. The shrapnel design provides stable contact pressure through a stainless steel spring structure, ensuring a plug-in life of over 100000 times. The terminal is made of 301 high conductivity copper alloy (conductivity ≥ 85% IACS), with a gold plating of 30 microinches on the surface and a contact impedance of<30m Ω. The shell is made of LCP liquid crystal polymer material (temperature resistance 350 ℃, UL 94 V-0 flame retardant), suitable for consumer electronics, industrial control, medical equipment and other scenarios.

  • Description
  • Product Compliance
  • Precautions
  • Make an inquiry

    Industry certification:

    Protocol authentication: Certified by USB-IF (USB3.1 Gen2/PD3.0), VESA (DisplayPort 1.4), HDMI Association (HDCP 2.3).

    Environmental certification: Compliant with RoHS 2011/65/EU (lead-free, halogen-free), ELV 2000/53/EC standards, LCP material recycling rate>90%.

    Safety certification: UL 94 V-0 flame retardant rating, CE/FCC electromagnetic compatibility certification, IPX7 waterproof tested by a third-party laboratory.

    Industry standards:

    Industrial applications comply with ISO 13849-1 (PLd) mechanical safety standards, while automotive electronics meet AEC-Q200 Rev E and ISO 16750-2 requirements.

    Quality control:

    Each batch is sampled for salt spray testing (48 hours), thermal cycling testing (-40 ℃ to 105 ℃, 1000 times), and dynamic contact impedance testing (Δ R<10% after 100000 insertions and removals).






    For more information, please contact us:


    - Hotline: +86 13310802726


    - Email: mc13310802726@163.com


    Installation requirements:

    Welding temperature: Reflow peak ≤ 255 ℃, maintain above 217 ℃ for 60-90 seconds. It is recommended to use nitrogen shielded welding (O ₂ content<100ppm) to avoid oxidation of LCP shell.

    Positioning accuracy: The PCB pad tolerance should be controlled within ± 0.05mm for a height of 1.6mm. It is recommended to design positioning columns (with a diameter of 1.0mm) to assist in installation. After welding, use 3D AOI to check the pin offset to be less than 0.03mm.

    Usage restrictions:

    Non waterproof models are prohibited from being exposed to humid environments. Waterproof models require regular inspection of the sealing ring (fluororubber, replacement cycle 1-2 years).

    When applying high current, the thickness of the PCB copper foil should be ≥ 50 μ m, and a 100nF ceramic capacitor (X7R) should be connected in parallel with the VBUS pin to suppress ripple and avoid overheating.

    Compatibility Description:

    The the third mock examination protocol requires device side chip support (such as TI TUSB8041). It is recommended to use USB-IF certified EMarker cable (such as USB4 Gen3).

    Maintenance suggestion:

    Clean interface dust with compressed air every quarter in industrial environments, wipe medical equipment with 75% ethanol, and prohibit chlorine containing disinfectants.

    When idle for a long time, use LCP dust cover to protect the interface, store at a temperature of -20 ℃ to 60 ℃, humidity ≤ 60% RH, and prevent copper terminal oxidation.






    For more information, please contact us:


    - Hotline: +86 13310802726


    - Email: mc13310802726@163.com


    If you have any special requirements or questions that require prior consultation. Please fill out the following form and we will have the specialist contact you as soon as possible.