Industry certification

USB-IF certification: Passed USB3.1 GEN2 and USB PD 3.0 certification (TID No.XXXX), supports eMarker cable recognition and dynamic power allocation.

Security certification:

UL 498 certification (file number EXXXXXX): No breakdown during withstand voltage test at 1500V AC/1min, terminal tension ≥ 8N, in compliance with IEC 62368-1 safety standard.

Copper shell grounding resistance ≤ 10m Ω, meeting the requirements of IT equipment grounding continuity.

Environmental certification:

RoHS 2.0/REACH SVHC compliance, LCP material recycling rate ≥ 90%, production process certified by ISO 14001 environmental management system.

Reliability testing

Environmental testing:

Salt spray test: 5% NaCl solution for 72 hours, copper shell and terminals have no corrosion (rating ≥ 9).

Temperature cycle: -40 ℃ to 85 ℃, contact resistance change ≤ 5% after 1000 cycles, LCP insulator has no cracks.

Electrical testing:

Signal integrity: 10Gbps data transmission error rate ≤ 10 ^ -12, eye opening ≥ 80% (28GHz bandwidth test).

Temperature rise test: Under 5A load, the temperature rise of VBUS terminal is ≤ 15 ℃, and the surface temperature of copper shell is ≤ 50 ℃ (ambient temperature is 25 ℃).

For more information, please contact us:

- Hotline: +86 13310802726

- Email: mc13310802726@163.com

Installation specifications

Welding parameters:

Wave soldering: temperature 260 ± 5 ℃, time 3-5 seconds. It is recommended to use silver containing solder (Sn96.5Ag3.0Cu0.5) to enhance the strength of the solder joint.

Manual welding: Temperature ≤ 320 ℃, time ≤ 3 seconds, prioritize welding the lower power pin (diameter 0.8mm) to ensure reliable grounding.

PCB design:

The double-layer pad spacing is 2.5mm, the through-hole diameter is 0.8 ± 0.05mm, and the power layer needs to be designed with ≥ 30mm ² copper cladding and copper shell connection.

It is recommended to use 100 Ω differential impedance control for the signal layer, with a spacing of ≥ 0.2mm between adjacent layers to reduce crosstalk.

Positioning requirement: Use a fixture to calibrate the verticality, with a tilt angle of ≤ 1 °, to avoid uneven force on the double-layer pins causing fracture.

Usage environment

Temperature and humidity range: working temperature -40 ℃ to 85 ℃, storage temperature -50 ℃ to 90 ℃, humidity ≤ 85% RH (no condensation).

Taboo scenario: It is prohibited to use it for a long time in strong acid-base (pH<4 or pH>10) and high dust (>200mg/m ³) environments to avoid copper shell oxidation affecting heat dissipation.

Maintenance suggestions

Regular testing: Measure the contact resistance (signal layer ≤ 30m Ω, power layer ≤ 20m Ω) using the 4-wire method every quarter, and calibrate the signal integrity using a network analyzer.

Cleaning and maintenance: Wipe the surface of the copper shell with anhydrous alcohol, and avoid using sharp tools such as steel wire balls to prevent damage to the nickel plating layer (thickness ≥ 50 μ ").

Long term storage: sealed in a moisture-proof bag (humidity ≤ 50%), avoiding contact between the copper shell and sulfides (such as sulfur-containing rubber), with a storage period of ≤ 2 years.

Compatibility Tips

Protocol matching: It needs to be paired with a main control chip that supports USB3.1 GEN2 (such as Renesas RAA227001), and the DisplayPort function requires an external re timer (such as TI DS80CC120).

Male head selection: Prioritize using TYPE C male heads with copper shells to ensure reliable contact between the shielding layer and the female copper shell (contact resistance ≤ 10m Ω).

For more information, please contact us:

- Hotline: +86 13310802726

- Email: mc13310802726@163.com