Installation specifications
Welding parameters: reflow soldering temperature of 250 ± 5 ℃, preheating at 150-200 ℃ for 90-120 seconds; Manual welding temperature ≤ 320 ℃ to avoid high temperature damage to LCP insulation.
PCB design: The solder pad aperture is 0.5 ± 0.05mm, and the pin insertion depth is 0.95 ± 0.02mm; the grounding pin needs to be separately designed with a copper-clad area of ≥ 10mm ² to enhance heat dissipation.
Positioning accuracy: The tolerance between the housing positioning column and the PCB hole is controlled within ± 0.03mm to prevent poor contact caused by installation tilt.
Usage restrictions
Environmental conditions: working temperature -40 ℃ to 85 ℃, humidity ≤ 85% RH; avoid exposure to strong acid-base or salt spray environments (>5% concentration).
Current load: The recommended continuous operating current is ≤ 2.5A, and the instantaneous peak current is ≤ 4A. Paired with E-Marker chip cable, it can achieve 100W fast charging.
Maintenance suggestions
Regular inspection: Use a 10x magnifying glass every quarter to check whether the solder joints are cracked and whether the terminals are oxidized; Wipe with anhydrous alcohol during cleaning, and do not use sharp tools to damage the gold plating layer.
Long term storage: When not in use, it should be sealed in a dry environment (humidity ≤ 60%). It is recommended to use a dust cap to protect the interface and prevent foreign objects from entering.
Compatibility notes
Device matching: It needs to be used in conjunction with a TYPE C female socket that complies with the USB-IF standard to avoid protocol incompatibility caused by non-standard interfaces.
Cable selection: USB 2.0 certified cables are required for data transmission, and it is recommended to use cables with 5A current carrying capacity for charging.
For more information, please contact us:
- Hotline: +86 13310802726
- Email: mc13310802726@163.com