Interface and transmission standard compliance
Fully compliant with the USB 2.0 specification released by the USB Implementers Forum (USB-IF), passing authoritative USB 2.0 compatibility testing to ensure high compatibility with various USB 2.0 TYPE C male heads and devices. The core indicators such as transmission rate, signal timing, and power supply stability all meet the requirements of USB 2.0 standard, effectively avoiding charging interruptions, data transmission lags, and device recognition issues caused by protocol incompatibility, and meeting the basic functional requirements of micro consumer electronic devices.
Environmental Compliance
Fully comply with the EU RoHS 3.0 (2015/863/EU) directive and China's GB/T 26572-2011 "Requirements for the Limitation of Substances in Electronic and Electrical Products", strictly limit the content of 10 harmful substances such as lead (Pb), mercury (Hg), cadmium (Cd), hexavalent chromium (Cr6+), etc. All raw materials such as 304 stainless steel, brass pins, LCP black glue, etc. have undergone environmental certification by third-party authoritative testing institutions such as SGS and TUV, and can provide compliance testing reports at any time. They are suitable for markets with strict environmental requirements such as the European Union, North America, and Japan, and have no market access barriers.
Electrical safety compliance
Compliant with IEC 62368-1 "Audio, Video, Information Technology, and Communication Technology Equipment Part 1: Safety Requirements", the electrical performance indicators fully meet the standards. Insulation resistance ≥ 100M Ω (500V DC), withstand voltage ≥ 500V AC (no breakdown or arcing for 1 minute), effectively prevent safety risks such as short circuit and leakage, and ensure the safety of equipment and user use; Simultaneously meeting the US FCC Part 15 Class B electromagnetic compatibility (EMC) standard, the electromagnetic radiation during signal transmission is ≤ 54dB μ V/m (30MHz~1GHz frequency band), avoiding interference with surrounding electronic components (such as Bluetooth modules and control chips in equipment) and ensuring stable operation of the equipment.
Production and Quality Compliance
The production process strictly follows the ISO 9001 quality management system and establishes a closed-loop control mechanism for the entire process of "raw materials production finished products". The raw material procurement process requires suppliers to provide complete qualification certificates, with a focus on testing the corrosion resistance of 304 material, the conductivity of brass pins, and the high temperature resistance of LCP black glue; Sampling inspection is conducted every hour during the production process, covering key indicators such as dimensional accuracy, conductivity, and appearance integrity; The finished product must pass 100% electrical performance testing and appearance inspection, and the non conformance rate must be strictly controlled below 0.1%. We can provide batch quality inspection reports according to customer needs to ensure the consistency of performance and quality stability of each batch of products.


For more information, please contact us:

- Hotline: +86 13310802726

- Email: mc13310802726@163.com

Storage and transportation precautions
The product should be stored in a dry and clean environment with a temperature of -5 ℃~35 ℃ and a relative humidity of 25%~55%. It should be avoided from being stored in places with high temperature and high humidity (such as near water sources or humidifiers), direct sunlight, dust, and corrosive gases (such as hydrogen sulfide, chlorine gas, and solder smoke) to prevent oxidation and rusting of brass pins, corrosion of 304 stainless steel shell, and aging and cracking of LCP black rubber base; During transportation, anti-static packaging (anti-static shielding bag+anti-static turnover box) should be used. Moisture proof agent should be placed inside the packaging, and "anti-static", "handle with care", and "moisture-proof" signs should be clearly marked on the outside to avoid violent handling that may cause the mother socket shell to break or the pins to bend.
After opening the packaging, unused products must be resealed and stored within 24 hours. Prolonged exposure to air is prohibited to prevent pin coating oxidation or dust contamination, which may affect conductivity and subsequent mounting effectiveness.
Precautions for installation operation
Before installation, it is necessary to confirm that the size of the PCB board solder pads matches the pins of the mother stand, and the solder pad error should be controlled within ≤± 0.05mm. The solder pad layout should be adjusted strictly according to the product specifications to avoid excessive solder pads causing continuous soldering and insufficient solder pads causing virtual soldering; When using SMT mounting, it is necessary to strictly control the reflow soldering temperature curve: the preheating section is 90 ℃~120 ℃ (lasting for 60~90 seconds), the peak section is 250 ℃~260 ℃ (lasting for ≤ 8 seconds), and the cooling section is ≤ 50 ℃. Excessive temperature or prolonged high temperature can cause the LCP black adhesive base to soften and deform, the pins to separate from the shell, and damage the stability of the product structure.
After installation, a comprehensive inspection must be conducted through AOI (automatic optical inspection) or high-power magnifying glass to confirm that the mother base is not tilted (tilt angle ≤ 1 °), the pins are not offset, and there are no defects such as virtual soldering/continuous soldering. If any abnormalities are found, professional tools (such as hot air guns) should be used for repair. Defective products are prohibited from entering the next process.
Precautions for use and maintenance
When in use, the input current should not exceed 3A rated value. It is forbidden to connect power adapters that exceed 3A (such as 65W fast charging heads) to avoid long-term overload that may cause brass pins to overheat and burn out, and LCP black rubber base to melt; When plugging and unplugging the TYPE C male head, it should be operated vertically and steadily, and tilting, rotating, or pulling with force is prohibited. Due to the product's lack of strip steel and compact size, its pull-out resistance is slightly weaker than conventional models. It is recommended to control the plugging and unplugging life within 5000 times to reduce contact problems caused by pin wear.
Regularly check whether there is dust or foreign matter inside the female socket interface. If there is, use a dry soft bristled brush to gently clean it. Do not use metal tools (such as tweezers or needles) to enter the interface to prevent scratching the brass pins or damaging the LCP black rubber base; When repairing the equipment, it is necessary to first disconnect the power supply, and then use professional tools to disassemble the PCB board. It is forbidden to directly bend the mother seat to avoid pin breakage or separation of the mother seat from the PCB board.


For more information, please contact us:

- Hotline: +86 13310802726

- Email: mc13310802726@163.com