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Type-c 24PIN sunken board female socket

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TYPE C female base 24PIN flat plate 2.35 front insert and rear paste SMT+DIP L=7.95 short body the third mock examination bullet free 304 high conductivity copper LCP

TYPE C female base 24PIN flat plate 2.35 front insert and rear paste SMT+DIP L=7.95 short the third mock examination bullet free 304 high conductivity copper LCP is a multi-functional connector designed for compact space. The sinking plate reduces the installation height by 2.35mm, and the front insertion and rear attachment (SMT+DIP composite fixation) enhance stability. The 7.95mm short body is suitable for small devices; The third mock examination compatibility (USB 2.0/3.2/PD) meets the requirements of data and fast charging, and no shrapnel design simplifies the structure; The combination of 304 stainless steel, high conductivity copper, and LCP material ensures durability and is widely used in small docking stations, smart wearable bases, industrial sensor modules, and other scenarios.

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    Interface and protocol compliance: Comply with USB Implementers Forum (USB-IF) USB 3.2 Gen1, USB 2.0 and PD 3.0 standards, pass the the third mock examination function compatibility test, ensure the compatibility with various TYPE C connectors and fast charging devices, and avoid transmission interruption and protocol incompatibility.
    Environmental compliance: Fully compliant with EU RoHS 3.0 (2015/863/EU) and Chinese GB/T 26572-2011, strictly restricting 10 harmful substances such as lead, mercury, cadmium, etc. Raw materials such as 304 stainless steel, high conductivity copper, LCP, etc. have passed SGS environmental testing and provided compliance reports.
    Electrical safety compliance: comply with IEC 62368-1 safety standard, insulation resistance ≥ 1000M Ω (500V DC), withstand voltage ≥ 500V AC (no breakdown for 1 minute); Electromagnetic shielding effectiveness ≥ 50dB (1GHz frequency band), meets FCC Part 15 Class B EMC requirements, and avoids interference with internal Bluetooth and Wi Fi modules of equipment.
    Compliance of production quality: follow the ISO 9001 system, conduct full process inspection (sink depth, pin continuity, the third mock examination function), sample 600 pcs per batch, with a rejection rate of ≤ 0.1%, and a batch quality report can be provided.


    For more information, please contact us:

    - Hotline: +86 13310802726

    - Email: mc13310802726@163.com

    Storage and transportation
    Storage environment: Temperature -5 ℃~35 ℃, relative humidity 25%~55%, avoid high temperature and humidity, direct sunlight or contact with corrosive gases (such as chlorine gas, solder smoke), prevent oxidation of 304 stainless steel shell and corrosion of high conductivity copper pins.
    Transportation requirements: Packaging in anti-static shielding bags and anti-static trays, with 800pcs per tray. Protective sleeves should be placed around the DIP pins and labeled with "Handle with care" and "Anti static" to avoid pin bending and shell deformation caused by compression.
    After opening: Unused products must be resealed within 24 hours and exposed to air for no more than 48 hours to prevent oxidation of the pin coating from affecting conductivity.
    Installation operation
    PCB design: The depth of the sink groove should match 2.35mm (tolerance ± 0.03mm), the SMT pad size should be 0.8mm × 0.6mm (spacing 0.5mm), and the DIP pin through-hole diameter should be 0.8mm (tolerance ± 0.05mm); The high-speed differential line needs to control impedance of 90 Ω± 10% and stay away from the 304 casing (to prevent abnormal signal shielding).
    Reflow soldering parameters: preheating section of 120-150 ℃ (50 seconds), peak section of 250-260 ℃ (≤ 8 seconds), cooling rate of ≤ 2 ℃/second, LCP base is resistant to high temperature but needs to avoid prolonged high temperature (to prevent deformation from affecting the accuracy of the sinking plate).
    Post installation inspection: Through AOI+X-ray inspection, it is confirmed that there is no virtual soldering on the SMT pads, the DIP pins are fully soldered (solder filling rate ≥ 90%), and there is no gap between the mother seat and the PCB board (tilt angle ≤ 0.5 °).
    Operation and Maintenance
    Current limit: VBUS power supply should not exceed 3A (at 20V), high conductivity copper pins have excellent conductivity but need to be matched with PCB thick copper foil (≥ 2oz) for heat dissipation to avoid overload heating.
    Insertion and extraction specifications: Vertical insertion and extraction of male heads is prohibited, and tilting or rotating force is prohibited. The non spring design relies on the fixation of the housing and PCB, and excessive force may cause the female seat to loosen (it is recommended to control the insertion and extraction life within 10000 times).
    Cleaning and maintenance: When there is dust on the interface, use a dry soft bristled brush to clean it. Do not touch the pins or housing with metal tools to prevent scratching the coating or damaging the adhesion of the sink plate.


    For more information, please contact us:

    - Hotline: +86 13310802726

    - Email: mc13310802726@163.com

    If you have any special requirements or questions that require prior consultation. Please fill out the following form and we will have the specialist contact you as soon as possible.