Installation specifications
Welding parameters: Reflow welding temperature 250 ± 5 ℃, manual welding ≤ 320 ℃, welding time ≤ 3 seconds, to avoid LCP overheating and deformation.
PCB design: solder pad spacing tolerance ± 0.05mm, recommended copper coating for power layer ≥ 20mm ², signal layer to power layer spacing ≥ 0.3mm.
Positioning requirements: Use fixtures to ensure that the clamp is vertical, with a tilt angle of ≤ 1.5 °, to prevent uneven force on the pins from breaking.
Usage environment
Temperature and humidity range: working temperature -20 ℃ to 85 ℃, storage temperature -30 ℃ to 90 ℃, humidity ≤ 85% RH (no condensation).
Taboo scenarios: Avoid using in strong electromagnetic environments (>50mT), high-frequency vibrations (>20g), or medical grade anti-interference scenarios.
Maintenance suggestions
Regular inspection: Visually inspect the solder joints for cracks every quarter, and use a multimeter to measure the VBUS/GND contact resistance (≤ 30m Ω).
Cleaning and maintenance: Wipe the terminals with anhydrous alcohol, avoid sharp tools, and prevent wear of the nickel plating layer (thickness ≥ 50 μ ").
Long term storage: Sealed in an anti-static bag (humidity ≤ 60%), avoiding contact between the shell and acidic substances, with a storage period of ≤ 2 years.
Compatibility notes
Functional limitations: It is recommended to use shielded cables for high-speed data transmission to reduce EMI noise.
Equipment matching: Suitable for full function TYPE C female socket, non full function female socket may cause partial protocol handshake failure (probability<3%).
For more information, please contact us:
- Hotline: +86 13310802726
- Email: mc13310802726@163.com