Industry certification:

Protocol certification: USB-IF (USB3.1 Gen2/PD3.1), VESA (DisplayPort 1.4), HDMI Association (HDCP 2.3) certification, ensuring compatibility with chips such as Intel JHL8040 and TI TUSB8041.

Environmental certification: RoHS 2011/65/EU (lead ≤ 0.1%, cadmium ≤ 0.01%), REACH SVHC 235 (phthalates ≤ 0.1%), LCP material recycling rate>95%.

Safety certification: UL 94 V-0 flame retardant (combustion rate ≤ 100mm/min), CE/FCC electromagnetic compatibility (conducted disturbance ≤ 38dB μ V, radiated disturbance ≤ 28dB μ V), IPX7 waterproof tested by a third-party CNAS laboratory.

Industry standards:

Industrial applications comply with ISO 13849-1 (PLd) mechanical safety standards, while automotive electronics meet AEC-Q200 Rev E (temperature cycling 1000 times, humidity 85%) requirements RH@85 1000 hours at ℃).

Quality control:

Sampling is conducted for each batch, including high current temperature rise test (5A/2 hours, VBUS terminal temperature ≤ 75 ℃), dynamic contact impedance test (Δ R<15% after 100000 insertions and removals), and metallographic section analysis (IMC layer thickness ≤ 2 μ m for solder joints).

For more information, please contact us:

- Hotline: +86 13310802726

- Email: mc13310802726@163.com

Installation requirements:

Welding temperature: Reflow peak ≤ 255 ℃, maintain above 217 ℃ for 60-90 seconds, and use insulation fixtures (temperature resistant to 120 ℃) in the positioning column area to avoid overheating and discoloration of the LCP shell (temperature resistance limit of 350 ℃, short-term tolerance).

Positioning accuracy: The tolerance between PCB through holes and positioning columns is ≤ 0.02mm. It is recommended to use a 0.01mm precision surface mount machine, and after welding, use 3D AOI to detect pin coplanarity<0.05mm.

Usage restrictions:

Non waterproof models are prohibited from being exposed to humid environments. Waterproof sealing rings are recommended to be replaced every 1000 insertions or 1 year (fluororubber, Shore hardness 70 ± 5A).

When applying 5A high current, it is necessary to ensure that the thickness of the PCB copper foil is ≥ 50 μ m (1.4oz), the VBUS wire width is ≥ 1.5mm, and a 100nF X7R ceramic capacitor (≤ 5mm from the interface) is connected in parallel to suppress high-frequency ripple.

Compatibility Description:

The third mock examination protocol requires device side chip support (such as Ruiyu RTS5490). It is recommended to use USB-IF certified 40Gbps EMarker cables (such as USB4 Gen3, AWG28). Non certified cables may cause PD handshake failure or data packet loss.

Maintenance suggestion:

Clean the interface dust with compressed air (0.5MPa) every quarter in industrial environments, and wipe medical equipment with 75% ethanol (chlorine containing disinfectants are prohibited) to avoid contact between LCP shells and strong acids and bases (customized protective coatings are required for pH values outside 5-9).

When idle for a long time, use LCP dust cover (sealed in static shielding bag), store at a temperature of -20 ℃ to 60 ℃, humidity ≤ 40% RH, and keep away from strong magnetic fields (>50mT) to prevent brass terminals from magnetizing.

For more information, please contact us:

- Hotline: +86 13310802726

- Email: mc13310802726@163.com