Industry certification:

Protocol authentication: Certified by USB-IF (USB3.1 Gen2/PD3.0), VESA (DisplayPort 1.4), HDMI Association (HDCP 2.3).

Environmental certification: Compliant with RoHS 2011/65/EU (lead-free, halogen-free), ELV 2000/53/EC standards, LCP material recycling rate>90%.

Safety certification: UL 94 V-0 flame retardant rating, CE/FCC electromagnetic compatibility certification, IPX7 waterproof tested by third-party laboratories (such as SGS).

Industry standards:

Industrial applications comply with ISO 13849-1 (PLd) mechanical safety standards, and medical scenarios can be customized with ISO 10993 biocompatibility testing (such as cytotoxicity and allergenicity).

Automotive electronics meet AEC-Q200 Rev E (vibration, temperature cycling, humidity) and ISO 16750-2 (electrical load) standards.

Quality control:

The entire production process is traced through the ERP system, and each batch is sampled for salt spray testing (48 hours, 5% NaCl), thermal cycling testing (-40 ℃ to 105 ℃, 1000 times), and contact impedance dynamic testing (Δ R<10% after 100000 insertions and removals).

For more information, please contact us:

- Hotline: +86 13310802726

- Email: mc13310802726@163.com

Installation requirements:

Welding temperature control: peak soldering furnace temperature of 260 ± 5 ℃, welding time of 5-8 seconds; The peak temperature of reflow soldering should be ≤ 255 ℃, and the holding time above 217 ℃ should be 60-90 seconds to avoid deformation of the LCP shell.

Positioning accuracy: The four pin plug board needs to be aligned with the PCB through-hole (tolerance ± 0.05mm). It is recommended to use a positioning fixture and check the fullness of the solder joints with a 3x magnifying glass after welding.

Usage restrictions:

Non waterproof models are prohibited from being exposed to humid environments. Waterproof models need to check the sealing ring (made of fluororubber material, recommended replacement cycle of 1-2 years) after long-term use.

When applying high current, it is necessary to ensure that the thickness of the PCB copper foil is ≥ 35 μ m (1oz), and it is recommended to parallel 100nF ceramic capacitors to suppress ripple for the VBUS pin.

Compatibility Description:

Automatically slow down to 480Mbps when connected to USB 2.0 devices, and DP video output requires the device to support Alt mode; Non certified cables may cause PD protocol handshake failure. It is recommended to pair them with USB-IF certified EMarker cables.

The the third mock examination protocol requires the support of device side chips (such as TI TUSB8041, Intel JHL8040). It is recommended to indicate the list of compatible chips in the product specification.

Maintenance suggestion:

Regularly wipe the interface surface with anhydrous ethanol to remove dust and oxide layer; It is recommended to clean internal debris with compressed air (0.5MPa) every quarter in industrial environments.

When idle for a long time, a dust cover (LCP material) should be used to protect the interface and prevent metal foreign objects from entering and causing short circuits. The storage environment temperature should be between -20 ℃ and 60 ℃, and the humidity should be ≤ 60% RH.

For more information, please contact us:

- Hotline: +86 13310802726

- Email: mc13310802726@163.com