Installation specifications
Welding parameters: Reflow soldering temperature of 250 ± 5 ℃, preheating at 150-200 ℃ for 90-120 seconds to avoid local overheating and carbonization of LCP insulation.
PCB design:
Pad width ≥ 0.5mm, spacing tolerance ± 0.03mm, it is recommended to use ENIG surface treatment (nickel gold thickness ≥ 3 μ m).
The grounding pin needs to be connected to ≥ 20mm ² copper cladding to improve EMI shielding and heat dissipation efficiency.
Positioning requirements: Use fixtures to ensure that the mother base is perpendicular to the PCB, with a tilt angle of ≤ 0.8 °, to avoid uneven force on the pins during side mounting.
Usage environment
Current limit: VBUS pin continuous current ≤ 4.5A, instantaneous peak value ≤ 6A, requires eMarker cable to achieve 100W fast charging.
Taboo scenario: Do not use in environments with humidity>90% RH, dust concentration>200mg/m ³, or strong acidity or alkalinity.
Maintenance suggestions
Regular cleaning: Use a cotton swab with anhydrous alcohol to wipe the surface of the terminal every quarter to remove oxides and dust. It is forbidden to use metal tools to scrape the gold plating layer.
Long term storage: Sealed and stored in anti-static bags (humidity ≤ 50%), with a storage period of ≤ 2 years, to avoid terminal oxidation and LCP moisture absorption.
Compatibility Tips
Protocol matching: It needs to be paired with a main control chip that supports USB 3.1 GEN2. Non standard protocols may result in degraded transmission rates.
Male head selection: Priority should be given to using TYPE C male heads with metal shells to ensure effective connection of the shielding layer and improve EMC performance.
For more information, please contact us:
- Hotline: +86 13310802726
- Email: mc13310802726@163.com