Industry certification

USB-IF certification: Passed USB3.1 GEN2 and USB PD 3.0 certification (TID No.XXXX), supports USB Type-C specification R2.1, and is compatible with mainstream operating systems (Windows/macOS/Linux).

Security certification:

UL 498 certification (file number EXXXXXX): No breakdown during withstand voltage test at 1500V AC/1min, terminal insulation strength ≥ 500V DC.

IEC 62368-1 compliance: Complies with safety standards for audio and video equipment, with a grounding resistance of ≤ 50m Ω for the enclosure

Environmental certification:

RoHS 2.0/REACH SVHC compliance: lead-free, halogen-free, LCP material recycling rate ≥ 90%.

ISO 14001 Environmental Management System Certification: Production process wastewater/exhaust emissions comply with GB 24694-2009 standard.

Reliability testing

Environmental testing:

Salt spray test: 5% NaCl solution, 72 hours, no corrosion on the shell/terminal (rating ≥ 8, GB/T 10125-2021).

Temperature cycle: -40 ℃ to 85 ℃, 1000 cycles, contact resistance change ≤ 8%, LCP insulator without cracks.

Mechanical testing:

Vibration test: 10-2000Hz, 20g acceleration, continuous for 2 hours, no cracking of solder joints (IPC-A-610E Level 3 standard).

Plug and unplug lifespan: Contact resistance ≤ 40m Ω after 5000 cycles, shell deformation ≤ 0.1mm.

For more information, please contact us:

- Hotline: +86 13310802726

- Email: mc13310802726@163.com

Installation specifications

Welding parameters:

SMT part: Reflow soldering temperature of 250 ± 5 ℃, preheating time of 90-120 seconds (150-200 ℃), to avoid local overheating of LCP (temperature threshold of 260 ℃).

Harpoon foot part: The wave soldering temperature is 260 ± 5 ℃, and the soldering time is 3-5 seconds. It is recommended to use silver containing solder (Sn96.5Ag3.0Cu0.5) to improve the strength of the solder joint.

PCB design:

Front small foot pad: width 0.6mm, length 1.2mm, spacing tolerance ± 0.03mm

Rear harpoon foot solder pad: aperture 0.8mm, hole spacing 2.0mm, grounding pin needs to be connected to ≥ 20mm ² copper-clad area.

Positioning requirement: Use a fixture to ensure that the mother base is perpendicular to the edge of the PCB, with a deviation angle of ≤ 1 °, to avoid uneven force on the pins during side insertion that may cause breakage.

Usage environment

Temperature and humidity range: working temperature -40 ℃ to 85 ℃, storage temperature -50 ℃ to 90 ℃, humidity ≤ 85% RH (no condensation).

Taboo scenario: Long term use in strong acid-base (pH<4 or pH>10), high concentration dust (>200mg/m ³), or strong magnetic field (>100mT) environments is prohibited.

Maintenance suggestions

Regular inspection: Check the integrity of solder joints using AOI equipment every quarter, and measure the contact resistance with a multimeter (normal ≤ 30m Ω).

Cleaning and maintenance: Use anhydrous alcohol (purity ≥ 99%) to wipe the surface of the terminal, and prohibit chlorine containing solvents (such as banana oil) to avoid damaging the gold plating layer.

Long term storage: If the mother base is not installed, it should be sealed in an anti-static bag (humidity ≤ 50%) with a storage period of ≤ 2 years to prevent LCP from absorbing moisture and terminal oxidation.

Compatibility Tips

Protocol matching: A main control chip that supports USB 3.1 GEN2 (such as Renesas RAA227001) is required to ensure normal high-speed data and PD fast charging functions.

Male head selection: Priority should be given to using TYPE C male heads with metal shells (such as USB-IF certified products) to ensure reliable grounding between the shielding layer and the female housing (contact resistance ≤ 10m Ω).

For more information, please contact us:

- Hotline: +86 13310802726

- Email: mc13310802726@163.com